SPM系列拋光機*APPARATUSTOPOLISHILICONWAFERSPLACEDONTHEBASEPLATEACCURATELYANDEFFICIENTLY*Perfectforsuper-accurateandefficientpolishingof wafers.*Turntablespeedissteplesslychangeableintherangeof0-50rpmwiththedialandthankstoitscushion-startdevicewaferscanbepolishedwithoutbeingdamaged.*Asthepolishingloadisappliedbythedeadweight,theloadsonthefourshaftsdonotchange.(5%orless)*Asthebaseplatecanbeputinoroutfromframeofthemachine,anoperatorsworkingspaceandthemachineinstallationspacecanbesmall.*Thebaseplatecanbeautomaticallytakenoutbyemployingaconveyerarm.Itisreadyforthefutureautomaticprocessinglines. 設(shè)備概要:本設(shè)備為半導(dǎo)體晶片用單面拋光機。使用機械與化學(xué)的結(jié)合方式對晶片進行高精度拋光?？蓪?yīng)各種半導(dǎo)體材料(包括硅,鍺,砷化鎵等)對應(yīng)工件尺寸: 4 ,5 ,6 晶片。 1．拋光加壓方式 重塊方式(帶有中心部氣缸加壓) 2．加工壓力 總壓力=拋光頭本身重量(材質(zhì)SUS304)+重塊重量(材質(zhì)SUS304) 重塊罩(SUS304,特氟隆表面處理)+PVC(每軸)